Applications
LED R&D
Formulation, preparation, and application of materials for LED R&D
Light Emitting Diodes (LEDs) have become the standard for lighting in recent years because of the many advantages they offer over incandescent or fluorescent options. To name a few, they use much less energy per lumen (up to 95% efficient), last an incredibly long time, and can be tuned to nearly any color of light. The cost of this relatively new technology has also dropped significantly as manufacturing methods have been scaled and further refined. This 97+ billion-dollar market is expected to grow 10+% in the coming years. You can expect to see many new use cases innovations as the need to differentiate product offerings increases.
Phosphors a critical component in LED lights as they absorb the blue light generated by the LED and emit different colors of light. This is the basis for natural looking LED lights and even LED displays. Proper dispersion of phosphor in a carrier is critical to achieve the desired performance. Mixing the phosphor with the carrier can be a difficult task as the phosphors have a relatively high density and a tendency to fall out of suspension. This means they must be mixed in smaller batches and resuspended just before application to the LED. Vacuum degassing the system is also generally necessary as this prevents the formation of bubbles/voids when the carrier is rapidly cured with heat.
One of the keys to achieving a long lasting and rugged product with any type of electronics is to encapsulate / “pot” the components. This hermetically seals them to keep out moisture & other materials that could damage the product or reduce performance. Potting also protects delicate components from vibration and shock. Properly mixing the potting compound ensures that it will cure fully and achieve the best physical properties. Vacuum degassing the potting compound will prevent bubbles or voids (especially when using heat to accelerate cure). It is an important step as those bubbles & voids could potentially cause a failure if unaddressed.
Why Hauschild SpeedMixer®
- Epoxy based adhesives are often used in place of or in addition to traditional fasteners. They provide a strong and permanent bond to a variety of materials like metals, ceramics, composites, and foams. They may be mixed with rheology modifiers like fumed silica, flocking for reinforcement, or beads to control the thickness of adhesive between bonded surfaces.
- To achieve the strongest possible bond, surfaces being bonded must be prepared by cleaning & sometimes roughening, epoxy components and additives must be weighed at the correct ratio as specified by the manufacturer, and the system must be mixed thoroughly. A vacuum degassing procedure is also often used to remove bubbles, dissolved gasses, or volatile content that could otherwise create voids or outgas. Once mixed, the epoxy will start to react and must be applied within the “working time” before it begins to gel or harden. The adhesives can often be packaged into cartridges to make application easier and faster so that nearly all the material can be used within the working time and waste is minimized.
Reduce operational costs with energy-efficient machines designed for rapid and thorough mixing, ensuring no unwanted bubbles & voids.
Easily scale your production from small batches to large quantities while maintaining uniformity and quality.
Our mixers handle a wide range of applications, including dispersing rheology modifiers like fumed silica and incorporating structures like hollow glass micro balloons to reduce density.